Press Release

OKI Launches IMS Support Service That Draws on ISO 56001 Certification Track Record

OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers

OKI Becomes First Japanese Company to Acquire ISO 56001 International Standard for Innovation Management Systems

OKI Receives Corporate Partner Award for the First Time at Plug and Play Silicon Valley June Summit 2025

OKI and NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding

OKI Establishes OKI Berlin Lab R&D Center in Berlin, Germany

OKI Publishes Technical Journal Featuring "Innovations utilizing Edge Platforms"

OKI Achieves 3D Integration of Thin-Film Analog ICs Using CFB Technology in Collaboration with Nisshinbo Micro Devices