2025 Semiconductor of the Year Award Ceremony

TOKYO, July 22, 2025 -- OKI (TOKYO: 6703) has received the Award for Excellence in the Semiconductor Device Category for its 3D integration of thin-film analog ICs, developed jointly with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka) at the 2025 Semiconductor of the Year award ceremony in June. This marks the first time OKI has won this award.

"Semiconductor of the Year" is a prestigious awards program in the electronics industry, and is hosted by Sangyo Times, Inc., publisher of Electronic Device Industry News. For each category, products and technologies are rigorously screened by editorial staff based on criteria such as technological innovation, mass production readiness, social impact, and future potential to select the most outstanding ones.

The 3D integration of thin-film analog ICs recognized by this award combines OKI's crystal film bonding (CFB) technology with analog IC technology cultivated by Nisshinbo Micro Devices over the years. This groundbreaking technology enables miniaturization by stacking while maintaining analog IC performance.

"We are truly honored to receive the Award for Excellence in the Semiconductor Device Category of the Semiconductor of the Year awards," comments Kei Kato, Executive Officer and Head of Global Marketing Center at OKI. "This award is the result of the support from all parties involved and the daily efforts of our employees on the front lines. Our cross-organizational innovation efforts both inside and outside OKI are bearing fruit. We plan to continue drawing on OKI's comprehensive strengths to further develop the CFB business, a symbol of transformation, and to contribute still further to society as a company active around the world."

This award marks an achievement shared by both companies, reflecting their desire to help revitalize Japan's semiconductor industry. Through the creation of a semiconductor innovation business as a pioneer driving OKI's transformation, we hope to be able to define a winning path for the new OKI. Additionally, OKI strives to further accelerate co-creation with Nisshinbo Micro Devices for early mass production of products and provision to society, thereby "Delivering OK! to your life."

About crystal film bonding (CFB) technology

CFB is a heterogeneous material bonding technology whereby only the functional layer is lifted off from a semiconductor substrate to form a thin-film semiconductor material, which is then bonded to a substrate made of a different material. The bonding process is performed at room temperature, without adhesives, relying just on intermolecular forces between the materials. OKI is currently expanding this technology to a wide range of crystal materials and devices as part of its CFB solutions initiative to help raise the added value of semiconductor devices. Lifting off crystal films (high-performance materials and heterogeneous functional devices) from seed substrates and bonding and integrating them onto different substrates allows for the creation of new added value.

CFB solution business model

Related links

• Creating innovation through OKI's CFB solutions
• OKI Achieves 3D Integration of Thin-Film Analog ICs Using CFB Technologies in Collaboration with Nisshinbo Micro Devices

About Oki Electric Industry (OKI)

Founded in 1881, OKI is Japan's leading information and telecommunication manufacturer. Headquartered in Tokyo, Japan, OKI provides top-quality products, technologies, and solutions to customers through its Public Solutions, Enterprise Solutions, Component Products, and Electronics Manufacturing Services businesses. Its various business divisions function synergistically to bring to market exciting new products and technologies that meet a wide range of customer needs in various sectors. Visit OKI's global website at https://www.oki.com/global/.

• * Information in the press releases is current on the date of the press announcement, but is subject to change without prior notice.

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