Press Release

OKI Signed Memorandum of Understanding with Turkish State Railways for the Proof of Concept Using Zero Energy IoT Series IoT Disaster Prevention Inspection and Monitoring Technology

OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers

OKI Announces Consolidated Financial Results for the First Quarter of the Fiscal Year Ending March 31, 2026

OKI Launches Rigid-Flex PCBs with Embedded Copper Coins Featuring Improved Heat Dissipation for Space Equipment Applications

OKI and Funai Soken Logistics Form Strategic Business Alliance to Promote DX in Logistics

OKI Becomes First Japanese Company to Acquire ISO 56001 International Standard for Innovation Management Systems

OKI Receives 2025 Semiconductor of the Year Award for Excellence for the First Time

Selected for Japan Cabinet Office's AUV Demonstration Project

OKI Receives Corporate Partner Award for the First Time at Plug and Play Silicon Valley June Summit 2025

OKI and Netmarks Indonesia to Deploy Projection Assembly System™ to Indonesian Market to Help Eliminate Production Site Errors

OKI Launches Small-Lot Custom Long FPCs for the New Space Industry

OKI and NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding

OKI Establishes OKI Berlin Lab R&D Center in Berlin, Germany

OKI Announces Financial Results for the Fiscal Year Ended March 31, 2025

Notice Regarding Differences between Consolidated Earnings Forecasts for the Fiscal Year Ended March 31, 2025 and Actual Results for the Same Period, and Dividends from Retained Earnings (Dividend Increase)