Special Edition on Component Technologies Supporting Innovative Design
Silicon photonics, a device technology drawing considerable attention, was employed, and an optical circuit configured from silicon-wire waveguides was designed and evaluated. As a sample application, a chip for a bi-directional communication module was fabricated and found to be useful for integration and miniaturization.
Reducing LED temperature rise is an important factor in achieving high output/high density LEDs. Using a proprietary “epi film bonding (EFB)” technology, thin film LEDs were successfully bonded directly to a thermal conductive substrate. Compared with conventional LED structures, this newly fabricated structure was found to significantly reduce the temperature of the LEDs.
In order to determine the viability of embedding an ultra-high frequency power amplifier IC into a printed circuit board, electrical and thermal properties were evaluated and verified through simulations. The result helped to demonstrate a technology capable of lowering high frequency application costs.
An embedded component module board that incorporates both active and passive components within the printed circuit board was successfully developed. Reliability testing revealed no problems with the electrical or mechanical properties. This technology was then applied to the miniaturization of printed circuit boards for use in wireless modules and IP cameras.
As image processing equipment increasingly become faster, OKI Electric Cable has developed a high-speed transmission FPC (flexible printed circuits) that can transmit at over 2Gbit/s up to a length of 3m. This article introduces the developed product and describes the efforts to improve transmission quality for the next generation of high-speed equipment.
Technical developments to achieve an 80-layer ultra-multilayer printed circuit board for utilization as a semiconductor test board were approached from the perspectives of 1) manufacturing, 2) board material and 3) design. There are expectations that the developed technologies will be expanded to the telecommunications market where high-speed, high-density boards are progressing.
