Press Release

OKI Launches IMS Support Service That Draws on ISO 56001 Certification Track Record

OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers

OKI Becomes First Japanese Company to Acquire ISO 56001 International Standard for Innovation Management Systems

OKI Receives Corporate Partner Award for the First Time at Plug and Play Silicon Valley June Summit 2025

OKI and NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding

OKI Establishes OKI Berlin Lab R&D Center in Berlin, Germany

OKI Publishes Technical Journal Featuring "Innovations utilizing Edge Platforms"

OKI Achieves 3D Integration of Thin-Film Analog ICs Using CFB Technology in Collaboration with Nisshinbo Micro Devices

OKI Announces Consolidated Financial Results for the First Half of the Fiscal Year Ending March 31, 2025

OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics Technology to Realize Various Optical Sensors

OKI Collaborates with 27pilots to Promptly Provide Solutions to Social Issues Using Venture Client Model

OKI Signs Partnership Agreement with US-based Plug and Play

OKI Issues Technical Journal Focusing on "OKI's Exponential Technologies towards the Future"

OKI Develops GaN Lifting off/Bonding Technology on QST Substrates of Shin-Etsu Chemical

OKI Releases Issue 241 of the OKI Technical Review Featuring "OKI's Contributions toward Green Society and Environment"