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OKI Technical Review
2024 Innovations utilizing Edge Platforms
Sensing Technology for Automatically Tracking Location of Objects in Warehouses [1.2MB] 
Kazuhide Yoshihara
The automatic inventory positioning system uses OKI's sensing technology to automatically track and record the location of goods, both indoors and outdoors, with little to no change to current operations. It reduces the labor of searching for lost goods caused by person-dependent management and recording errors, therefore contributing to the efficiency of warehouse operations.
Development of Bi-Directional CDN for Beyond 5G Video Services [531KB]
Minori Takahashi, Hideki Yamamoto, Norio Kondo, Ikunori Okano, Masato Iwashita
In Society 5.0, various video services will be provided through autonomous robots connected to high-quality networks. This article describes the functions of the bi-directional CDN, which is required for Society 5.0 video services, and the prototypes that were developed.
Development of Underwater Acoustic Communication for Underwater Networks [350KB]
Hiroyuki Takeda, Takahiro Nakatsu
OKI is developing acoustic communication to form an underwater network that covers the vast sea. This article presents an overview of the development of one-to-one communication (32kbps, 2km) and one-to-N communication, which are the basis for forming underwater networks.
Printing Technology to Improve Efficiency and Support Module Expansion [838KB]
Kenji Sawaguchi, Toshiyuki Yoshida, Teruaki Kuroda, Atsushi Asami, Mitsuyoshi Shirasaka
OKI's solutions that pursue labor-saving and efficiency improvements in various printing fields are presented. The article introduces built-in / module expansion features, such as an AI automatic correction function that adjusts the printing position of a rolled media printing unit according to the used medium, and printing technology that enables ultra-long media printing in cooperation with printing equipment manufacturers.
Manufacturing Method of Printed Wiring Board with High Heat Dissipation [724KB]
Akihiro Yamamura
As power consumption of devices mounted on printed wiring boards increases, how to dissipate heat from the devices has become an issue. This article describes a printed wiring board with high heat dissipation based on a new manufacturing method for efficient heat dissipation.
Thermal Analysis of Rocket-Mounted Enclosures -Simulation of Unsteady Heat Transfer in Vacuum Environment- [398KB]
Naoya Tonooka, Keiichi Fujino
Since rocket-mounted enclosures are used in outer space, heat countermeasures in a vacuum environment are necessary. When developing enclosures, OKI performs thermal analysis in the upstream design process to determine the design policy, and in the case of rocket-mounted enclosures, "simulation of unsteady heat transfer in vacuum environment" is performed. This article introduces the method used for thermal analysis and points out precautions to take when designing enclosures.
Stacked Integration of Analog ICs using "Thin Film Chiplets" by CFB [803KB]
Takuma Ishikawa, Kenichi Tanigawa, Hironori Furuta, Hideharu Kuwabara, Kouhei Kuwahara
Analog semiconductors, which amplify weak signals from sensors and other edge devices, are recently facing increasing demand for more sophistication due to technological advances in AI and autonomous driving. However, analog semiconductors have limitations on their sophistication because their characteristics deteriorate with miniaturization. This article introduces a new CFB technology that uses chiplets to enhance analog semiconductors.
Miniaturization of Distributed Optical Fiber Sensor [447KB]
Riku Hiroto, Kengo Koizumi, Yoshihiro Kanda, Yosuke Onawa, Daisuke Shimura
In an aim to spread mass-producible optical sensors to the edge domain, OKI is working on research and development of optical fiber sensors using its platform for optical integrated circuits. This article presents an optical fiber sensing method suitable for optical integration, and introduces the results of its verification and a new technology to suppress interference.
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