OKI Enhances Range of Thermal Characteristics Analysis Services for Semiconductor Devices
Rapid, high-precision measurements of thermal characteristics for power devices and optical devices
TOKYO, September 29, 2010 -- OKI Engineering, an OKI Group company offering reliability assessments and technical solutions in the field of environmental protection announced that today it has expanded its range of thermal characteristics analysis services for semiconductor devices. A service that measures the thermal resistance(*1) and heat capacity(*2) of power devices and optical devices will be available from today.
Recently, heat generated in electronic equipments can possibly have a big influence on the malfunction and the breakdown of electronic equipments etc. by the high integration and the density growth of semiconductor devices. Therefore, it is very important to accurately grasp the thermal characteristics of a new semiconductor device at the design stage. Generally, TEG(*3) is used to measure its thermal resistance at the design stage, However, TEG method can only measure thermal resistance of an entire semiconductor device and thermal resistance values often deviate between the semiconductor device itself and the device that is assembled in an equipment. Additionally, preparing TEG is time-consuming.
"Based on our expertise and experience in reliability test and analysis, we have been providing services that precisely and rapidly evaluate the thermal characteristics of relatively small power semiconductor devices since December 2009," says Yutaka Asai, President of OKI Engineering. "Now, with our expanded thermal characteristics analysis services, we have enhanced the scope and are targeting power devices and optical devices that require large amount of electric power. Deploying a unique measurement method, these services evaluate and analyze thermal characteristics per composite materials of semiconductor devices. This approach eliminates the need of a TEG and allows rapid measurements and flexible response to changes of materials."
The service presents thermal characteristics data visually as graphs, making thermal characteristics easy to understand. The company will also be able to assess the heat dissipation effects of assembly boards with composite materials, heat-radiation materials, and heat-sinks.
OKI Engineering will exhibit the service at CEATEC Japan 2010 (Booth 6C22 at Makuhari Messe) from October 5 to 9. On October 6, from 14:00 to 15:00, the company will deliver a lecture entitled "Thermal Characteristics Analysis to Enhance the Reliability of Electronic Devices" as part of the series of exhibitors' lectures.
Features of thermal characteristics analysis service
- Thermal characteristics analysis corresponding to package and element compositions.
- Estimates of guaranteed environmental temperatures based on device power consumption.
- Assessments of optimization based on analysis of various materials and compositions.
- Eliminates the need of TEG, and accelerates evaluations and analysis.
- Allows evaluations of complete products (i.e., at the product stage).
An example of thermal characteristics analysis
Brown line: without heat sink
Blue line: heat sink A, with grease
Black line: heat sink B, without grease
Glossary
- *1 :Thermal resistance
Numerical conversion of heat conduction, or heat difference divided by heat flux (such as θja, ψjt, θjc)
- *2 :Heat capacity
The heat required to raise the temperature of an object by a certain amount.
- *3 :TEG (test element group)
General term for elements used in evaluations to identify problems at the design and production stages. It is possible to measure thermal characteristics of semiconductor devices on assembled board of the final products.
About OKI Engineering Co., Ltd.
As an engineering expert, OKI Engineering deploys unique and speedy engineering services based on technical expertise in various areas, such as reliability test and analysis, ESD protection design, environmental systems design, chemical analysis, EMC test, and instruments calibration. The company provides services and support solutions matching the needs of its customers. For more information, please visit http://www.oeg.co.jp/en/.
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- * Information in the press releases is current on the date of the press announcement, but is subject to change without prior notice.