2010 No.216 Special Edition on Component Technologies Supporting Innovative Design
Daisuke Shimura, Kyoko Kotani, Hiroyuki Takahashi, Hideaki Okayama, Hiroki Yaegashi
Silicon photonics, a device technology drawing considerable attention, was employed, and an optical circuit configured from silicon-wire waveguides was designed and evaluated. As a sample application, a chip for a bi-directional communication module was fabricated and found to be useful for integration and miniaturization.
Tomohiko Sagimori, Masataka Muto, Hiroyuki Fujiwara, Mitsuhiko Ogihara
Reducing LED temperature rise is an important factor in achieving high output/high density LEDs. Using a proprietary “epi film bonding (EFB)” technology, thin film LEDs were successfully bonded directly to a thermal conductive substrate. Compared with conventional LED structures, this newly fabricated structure was found to significantly reduce the temperature of the LEDs.
Masanori Itoh, Shinichi Hoshi, Hiroshi Iinaga
In order to determine the viability of embedding an ultra-high frequency power amplifier IC into a printed circuit board, electrical and thermal properties were evaluated and verified through simulations. The result helped to demonstrate a technology capable of lowering high frequency application costs.
Development of Printed Circuit Board Technology Embedding Active and Passive Devices for e-Function Module [822KB]
Noboru Fujimaki, Kiyoshi Koike, Kazuhiro Takami, Sigeyuki Ogata, Hiroshi Iinaga
An embedded component module board that incorporates both active and passive components within the printed circuit board was successfully developed. Reliability testing revealed no problems with the electrical or mechanical properties. This technology was then applied to the miniaturization of printed circuit boards for use in wireless modules and IP cameras.
Development of High-speed Long Transmission FPC - Enables 3m Long; 10 Times Longer than Conventional FPC - [432KB]
As image processing equipment increasingly become faster, OKI Electric Cable has developed a high-speed transmission FPC (flexible printed circuits) that can transmit at over 2Gbit/s up to a length of 3m. This article introduces the developed product and describes the efforts to improve transmission quality for the next generation of high-speed equipment.
Technical developments to achieve an 80-layer ultra-multilayer printed circuit board for utilization as a semiconductor test board were approached from the perspectives of 1) manufacturing, 2) board material and 3) design. There are expectations that the developed technologies will be expanded to the telecommunications market where high-speed, high-density boards are progressing.