2002 No.190 Special Edition on Devices
Masayoshi Ino, Tetsuzo Taniguchi
Hiroyuki Hanamori, Soichiro Inaba, Kiyotake Togo
Oki has developed the µPLAT® -92 core and hardware development environment containing the ARM920T CPU and peripheral IO devices, aimed at the portable terminals market where high speed and low power consumption are required. This essay traces the development of this product and gives an overview of its principal characteristics.
Tetsuo Nakazawa, Koichi Takeda, Mitsunori Nakata, Osamu Nakazawa
An MCU has been designed and developed to provide all the features required in a system LSI, from the perspective of software-oriented systems. By concentrating on the functions required from a software viewpoint, to achieve a minimum functional composition, Oki has produced a low-cost MCU, which, when based on the µPLAT-7B, will provide excellent expandability and easy integration into ASSP and ASCP.
Yoshihito Shimazaki, Akira Ikeda, Hiroyuki Mori, Masato Yamazaki, Toshimichi Naoi, Hidenori Akita
This paper introduces Oki's solution for seamless connectability between public subscriber networks based on W-CDMA, and peripheral networks, or PANs, belonging to individual users. We look at baseband system solutions, the features of baseband signal processing, and the specifications of related system LSIs.
Shoji Tanouchi, Hiroshi Shinotsuka, Kazuhiko Bando, Kyotaro Nakamura
Oki has developed the ML67Q5200 LSI, based on SPA (Silicon Platform Architecture), for silicon audio players, to control the whole player system, including signal processing of sound data, and copyright protection management. Using this LSI, a high-performance silicon audio player can be developed in a very short timeframe.
Koichi Yokomizo, Masato Umetani, Sunao Mizunaga, Ken Fujita, Akira Yoshida, Masaaki Ito
Bluetooth™ is the one of the world standards for wireless communications, enabling two-way connection between electronic devices by means of short-distance wireless links, instead of cables. This essay introduces Oki's Bluetooth™-compatible RF transceiver LSI, and its circuit block structure. (Note: Bluetooth is a trademark of Bluetooth SIG, Inc. USA.)
We have investigated the possibilities of fully-depleted SOI-CMOS devices, widely anticipated as next-generation low-power devices, on the basis of scaling models of conventional bulk CMOS. Using FD-SOI, ultra-low-power LSIs of the order of several 10 mW were achieved.
Oki has introduced design-for-testability aimed at cutting test times for system LSIs, and the company has developed and implemented design automation tools to carry out these procedures. This essay looks at the design automation tools, the design flow, and the test time reductions achieved.
Multi-chip package with built-in W-CSP enables development of system LSI for high-density devices [179KB]
Yoshihiro Saeki, Yasufumi Uchida
A multi-chip package with built-in W-CSP has been developed which enables layering of same-size chips in thin structures, using low-cost and lead-free techniques. This package is aimed at the small-scale portable device market.
Kazushige Noguchi, Satoshi Terada, Nobuyoshi Sakamoto, Tomokazu Komazaki
This essay looks at the circuit composition and design techniques used in Oki's full-band SAW antenna duplexer package, designed for use in domestic CDMA mobile terminals. It also gives design and trial manufacture results for frequency characteristics with respect to various simulations.
Takamitsu Furukawa, Norio Moriyama, Kazuo Sawai, Hiroshi Onoda
Using KrF lithography processes and thermal flow of the photoresist, it is possible to form sub-100 nm contact holes, and large-scale shrinking from a 280 nm hole diameter to 80 nm can be achieved by simple processing settings.
Kiyoshi Nagai, Hiroshi Wada
Here, we describe the structure and properties of a 40 Gb/s EA modulator, a key component in 40 Gb/s optical communications systems. We also report on the system applicability of this device, based on modulation experiments using 40 Gb/s signals.
This essay introduces our IC set for optical transmission modules, developed using GaAs FET and HEMT elements. The most important factor in differentiating systems is the high-speed devices used, and customers therefore demand excellent performance, reliability and mass producibility, as well as low cost. Our GaAs IC for 10 Gb/s communications displays outstanding performance compared to rival products, and has helped to develop our optical communications component business.
Hideki Takagi, Takeo Horio, Tomokazu Takahashi, Masaaki Umezawa
The 10 Gb/s optical transceiver is an integrated transmission/reception module for optical communications with a built-in MUX/DEMUX. The optical interface is compliant with SONET OC-192/ITU-T STM-64, and the electrical interface is a 622Mb/s x 16 @ LVDS using 300 pin connectors.
Hiroshi Ishizaki, Hiroshi Okada, Takayuki Tanaka, Yoshinori Arai
Alongside the spread of the Internet in recent years, high-speed data transmission services via subscriber networks (access networks) have taken root in a real way. This essay starts with a brief discussion of B-PON systems, and goes on to introduce the 155 Mb/s OLT/ONT optical transmission module developed by Oki, which is a key device in optical systems of this kind.
Keiji Okuda, Takahiro Yamada, Yasushi Harano, Youkou Hirose
Today, information communications networks are being required to handle a whole host of information, such as Internet-based animated images, and other data, in addition to traditional, analogue telephone and facsimile communications. In order to cope with the growing size and diversity of communications traffic, there have been moves to increase capacity and functionality in communications nets by adopting optical networks like that illustrated in Fig. 1.
This paper introduces Oki Electric's solutions in this field - a group of optical communications modules (an ONU module for ATM-PON systems, 2.5 Gb/s MINI-DIL type LD module and 10 Gb/s PD-TIA module) which are vital elements for achieving higher capacity and functionality, and lower communications charges, in the respective access system networks, metropolitan networks, and backbone networks which make up the overall optical network structure.
Shinya Abe, Hiroshi Kasai, Kenyo Tobita, Susumu Nakaya
This essay reports on the current state of product development at Sigma-Links Inc., giving details of their main products relating to SFF (Small Form Factor) and SFP (Small Form factor Pluggable), which are attracting attention worldwide as de facto standards for optical transceivers.
Toshiro Suemune, Minoru Teshima, Masatoshi Nakamura
Serial Impact Dot Matrix (SIDM) printers made by Oki Electric are currently used the world over, under the product name "Microline". By developing unique components, printing controls and device mechanisms, we were able to create excellent reliability and turn the Microline into a highly successful global brand. This essay traces the origins of the Microline, its subsequent progression, and its future prospects, focussing on the technical developments involved at each stage.